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Brand Name : Xilinx
Model Number : XCVU3P-2FFVC1517I
Place of Origin : Original
MOQ : 1pcs
Price : Please contact us
Payment Terms : T/T, Western Union, PayPay, MoneyGram
Supply Ability : 500pcs Per Mouth
Delivery Time : 5-7work days
Packaging Details : 21Pcs
Product Category : FPGA
Description : Virtex UltraScale+ 560 I/O 862050 LE
Package : FBGA-1517
Unit Weight : 0.905479 oz
Warranty : 180Days
Shipping by : DHL\UPS\Fedex\EMS\HK Post
Xilinx Ic Chip Programmer XCVU3P-2FFVC1517I 560 I/O 49260 LAB XCVU3P 40 Transceiver
Specifications
Product Attribute | Attribute Value |
---|---|
Xilinx | |
Product Category: | FPGA - Field Programmable Gate Array |
XCVU3P | |
862050 LE | |
560 I/O | |
850 mV | |
850 mV | |
- 40 C | |
+ 100 C | |
32.75 Gb/s | |
40 Transceiver | |
SMD/SMT | |
FBGA-1517 | |
Distributed RAM: | 12 Mbit |
Embedded Block RAM - EBR: | 25.3 Mbit |
Number of Logic Array Blocks - LABs: | 49260 LAB |
Operating Supply Voltage: | 850 mV |
Product Type: | FPGA - Field Programmable Gate Array |
Description
Xilinx® UltraScale™ architecture comprises high-performance FPGA, MPSoC, and RFSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements. Artix® UltraScale+ FPGAs: Highest serial bandwidth and signal compute density in a cost-optimized device for critical networking applications, vision and video processing, and secured connectivity.
Kintex® UltraScale FPGAs: High-performance FPGAs with a focus on price/performance, using both monolithic and next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost.
Kintex UltraScale+™ FPGAs: Increased performance and on-chip UltraRAM memory to reduce BOM cost. The ideal mix of high-performance peripherals and cost-effective system implementation.
Kintex UltraScale+ FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope. Virtex® UltraScale FPGAs: High-capacity, high-performance FPGAs enabled using both monolithic and next-generation SSI technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance to address key market and application requirements through integration of various system-level functions.
Virtex UltraScale+ FPGAs: The highest transceiver bandwidth, highest DSP count, and highest on-chip and in-package memory available in the UltraScale architecture.
Virtex UltraScale+ FPGAs also provide numerous power options that deliver the optimal balance between the required
system performance and the smallest power envelope. Zynq® UltraScale+ MPSoCs: Combine the Arm® v8-based
Cortex®-A53 high-performance energy-efficient 64-bit application processor with the Arm Cortex-R5F real-time processor
and the UltraScale architecture to create the industry's first programmable MPSoCs. Provide unprecedented power savings,
heterogeneous processing, and programmable acceleration.
Zynq® UltraScale+ RFSoCs: Combine RF data converter subsystem and forward error correction with industry-leading
programmable logic and heterogeneous processing capability. Integrated RF-ADCs, RF-DACs, and soft decision
FECs (SD-FEC) provide the key subsystems for multiband, multi-mode cellular radios and cable infrastructure.
Features
Most Zynq UltraScale+ RFSoCs include an RF data converter subsystem, which contains multiple radio frequency
analog to digital converters (RF-ADCs) and multiple radio frequency digital to analog converters (RF-DACs). The
high-precision, high-speed, power efficient RF-ADCs and RF-DACs can be individually configured for real data or
in most cases can be configured in pairs for real and imaginary I/Q data. See RF-ADCs and RF-DACs sections
Some Zynq UltraScale+ RFSoCs include highly flexible soft decision FEC blocks for decoding and encoding data
as a means to control errors in data transmission over unreliable or noisy communication channels. The SD-FEC
blocks support low-density parity check (LDPC) decode/encode and Turbo decode for use in 5G wireless, backhaul,
DOCSIS, and LTE applications.
Zynq UltraScale+ MPSoCs and RFSoCs feature dual and quad core variants of the Arm Cortex-A53 (APU) with dual-core
Arm Cortex-R5F (RPU) processing system (PS). Some devices also include a dedicated Arm Mali™-400 MP2 graphics
processing unit (GPU).
Trading Guide
Shipping | Delivery period | For in-stock parts, orders are estimated to ship out in 3 days.Once shipped, estimated delivery time depends on the below carriers you chose: |
Shipping rates | After confirming the order, we will evaluate the shipping cost based on the weight of the goods | |
Shipping option | We provide DHL, FedEx, EMS, SF Express, and Registered Air Mail international shipping. | |
Shipping tracking | We will notify you by email with tracking number once order is shipped. | |
Returning warranty | Returning | Returns are normally accepted when completed within 30 days from date of shipment.Parts should be unused and in original packaging.Customer has to take charge for the shipping. |
Warranty | All Retechip purchases come with a 30-day money-back return policy, This warranty shall not apply to any item where defects have been caused by improper customer assembly,failure by customer to follow instructions, product modification, negligent or improper operation | |
Ordering | Payment | T/T,PayPal, Credit Card includes Visa, Master, American Express. |
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Xilinx Programmable IC Chips XCVU3P-2FFVC1517I Images |